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Gateway Core Board

TRNF: DC 3.3V

Standard Protocol Rapid Development Widely Used Flexible Matching

The gateway package solution of RG5011+COO module is a solution developed by Rexense IoT that can flexibly customize the gateway. This solution combines the RG5011 gateway core board with different COO modules to form different gateway packages, which greatly reduces the difficulty and cycle of gateway hardware development.Based on the Rexense gateway chip package solution, rapid customized development of finished gateways or PCBAs can be achieved, and the development and production of gateway prototype samples can be completed in as little as 2 weeks. This solution has extremely high flexibility and scalability, and can be freely matched with single Ethernet, dual Ethernet, Wi-Fi4, Wi-Fi5, Wi-Fi6, dual-band Wi-Fi, RS485, 4G LTE and other communication methods.

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Scheme Advantages Gateway Architecture Product Specification Encapsulation Information Application Scenario COO Module Recommendation

Scheme Advantages

High Performance

Equipped with a self-developed module, the excellent module RF performance ensures a communication distance of >300 meters in an open environment and stronger signal penetration capabilities.It also supports edge computing and provides efficient and reliable communication.
High Reliability

Relying on professional hardware design capabilities and strict testing process standards, the solution can ensure the high consistency of factory gateway core board quality and long-term reliable operation in harsh environments.
High Expansion

It supports a variety of communication methods and can be freely matched with single Ethernet, dual Ethernet, Wi-Fi4, Wi-Fi5, Wi-Fi6, dual-band Wi-Fi, RS485, 4G LTE and other communication methods.
High Usability

With the support of complete Zigbee functions and gateway application functions and detailed plug-in development documents, customers only need to develop plug-ins (support MQTT protocol) to realize cloud platform docking, lowering the threshold for secondary development.
High Robustness

Through the in-depth optimization of the underlying routing algorithm of the protocol, the stability of multi-node device networking is improved, and the low packet loss rate and low delay are guaranteed under high throughput.

Gateway Architecture

Product Specification

Chip: SSD212

Processor: ARM Cortex-A7 dual core

Working frequency: 1.0GHz

RAM: 64MB

Flash: 128MB（Expandable up to 512MB）

LAN: Support

WAN: Support
Product Size: 23.0*35.0*2.8mm（With shielding cover）

TRNF: DC 3.3V

Operating Temperature: -20℃~85℃

Working humidity: 10~95%（Does not condense）

Storage Temperature: -40℃~150℃

Storage Humidity: MSL3 level